A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0-9
  • EN

Connector evolution in data center applications

  • March 31, 2021

Chris Tutt

Program Manager - Senko Advanced Components

Christopher Tutt (Chris) has been the program manager for the CS® and SN® Fiber Optic Interconnect solutions at Senko Advanced Components, Inc. for the last 3 years with responsibility for developing and promoting product growth for this new technology.  Chris has over 30 years’ experience in the Interconnect industry and related technologies. He holds 4 patents related to Interconnects and has published one technical paper. Chris is a veteran of the US Navy where he received his training in computer and radar technology.

In his spare time, Chris enjoys spending time with his family, watching baseball, and playing with the family dog.

Guillaume Lavallée

Product Line Manager

Guillaume Lavallée is a Product Line Manager at EXFO. Guillaume is responsible for the optical solutions in the Installation & Maintenance division. He holds an MBA and a university degree in Physics Engineering specialized in optics. Guillaume has over 12 years of experience in the telecom industry during which he has built a strong expertise in test and measurement best practices.

Anabel Alarcon

Product Specialist

Anabel Alarcon brings to EXFO ten years of experience on networking troubleshooting for IP, MPLS and mobile backhaul technologies, her background allowed her to be part of the support team on the most important network manufacturers on the market. Supporting different services provider’s networks across Latin America, participating on product introduction and infrastructure implementation, also becoming account dedicated engineer for the most important service provider in Mexico.

In data center environments, an increase in density can bring important benefits to operators. To support high-density data centers, new ultra-small form factor fiber connectors (USFF) such as SN and CS are gaining popularity amongst both datacom and telecom operators. Transceiver types with these connectors have been adopted by QSFP-DD, OSFP and SFP-DD Multi Source Agreement groups (MSAs) to increase bandwidth and at least double the density in order to address the need for ultra-high density optical interconnectivity demands of enterprise and hyperscale data centers. As a result, new fiber configurations are emerging to support new connector types such as Leaf and Spine. These connector types are emerging as the interconnect of choice.

As industry standards continue to evolve, new duplex connector types are joining 400G breakout applications. And data centers are looking to adopt emerging trends to add flexibility in network cabling design and deliver on high-speed migration inside the data center.

Key takeaways

  • CS and SN history, standards and applications
  • QSFP-DD/OSFP and SFP-DD transceiver overview
  • fiber testing best practices
  • protocol testing 2x100GE and 4x100GE breakout cables

Listen to this webinar, jointly hosted by EXFO and Senko, and learn how next-generation data centers can both future-proof themselves against inevitable increases in demand and ensure network reliability.

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