Program Manager - Senko Advanced Components
Christopher Tutt (Chris) has been the program manager for the CS® and SN® Fiber Optic Interconnect solutions at Senko Advanced Components, Inc. for the last 3 years with responsibility for developing and promoting product growth for this new technology. Chris has over 30 years’ experience in the Interconnect industry and related technologies. He holds 4 patents related to Interconnects and has published one technical paper. Chris is a veteran of the US Navy where he received his training in computer and radar technology.
In his spare time, Chris enjoys spending time with his family, watching baseball, and playing with the family dog.
Product Line Manager
Guillaume Lavallee is a product line manager at EXFO, the communications industry’s test, monitoring and analytics experts. He oversees the optical products in the Installation and Maintenance division. He has more than 15 years of experience in telecom test and measurement, related technologies and best practices. Guillaume has a bachelor’s degree in Physics Engineering, specialized in Optics, as well as an MBA from Canada’s University Laval.
Anabel Alarcon brings to EXFO ten years of experience on networking troubleshooting for IP, MPLS and mobile backhaul technologies, her background allowed her to be part of the support team on the most important network manufacturers on the market. Supporting different services provider’s networks across Latin America, participating on product introduction and infrastructure implementation, also becoming account dedicated engineer for the most important service provider in Mexico.
In data center environments, an increase in density can bring important benefits to operators. To support high-density data centers, new ultra-small form factor fiber connectors (USFF) such as SN and CS are gaining popularity amongst both datacom and telecom operators. Transceiver types with these connectors have been adopted by QSFP-DD, OSFP and SFP-DD Multi Source Agreement groups (MSAs) to increase bandwidth and at least double the density in order to address the need for ultra-high density optical interconnectivity demands of enterprise and hyperscale data centers. As a result, new fiber configurations are emerging to support new connector types such as Leaf and Spine. These connector types are emerging as the interconnect of choice.
As industry standards continue to evolve, new duplex connector types are joining 400G breakout applications. And data centers are looking to adopt emerging trends to add flexibility in network cabling design and deliver on high-speed migration inside the data center.
Listen to this webinar, jointly hosted by EXFO and Senko, and learn how next-generation data centers can both future-proof themselves against inevitable increases in demand and ensure network reliability.