A scalable, automated approach to testing photonic integrated circuits.

Testing is critical across the photonics lifecycle—from design and validation to manufacturing. EXFO delivers a complete, flexible and repeatable approach to testing PIC and optical components. By combining OPAL automated test stations, high‑performance optical testers and the EXFO Pilot automation software, labs and production lines can streamline testing and generate reliable, data‑driven results.

Proven performance for scalable PIC testing

From early photonics research to high-volume manufacturing, EXFO’s automated approach delivers precise, repeatable measurements across every stage of the PIC lifecycle.

Complete automated PIC testing workflow—from lab research to manufacturing.

Scalable architecture supporting single‑die, multi‑die and wafer‑level testing.

Compatible with EXFO and third‑party instruments for flexible integration.

Automate and scale PIC testing—from single-die to wafer‑level characterization.

EXFO’s integrated testing approach combines OPAL automated probe stations, industry‑leading optical test instruments and the EXFO Pilot automation software. Together, these elements create a flexible and scalable platform capable of supporting research labs, R&D environments and high‑volume manufacturing.

OPAL stations enable precise optical alignment and repeatable measurements, while EXFO’s modular optical testers provide advanced characterization capabilities such as tunable laser measurements, passive component testing, optical switching and attenuation control. EXFO Pilot orchestrates the entire test workflow—from setup and instrument control to measurement analysis—transforming raw measurements into actionable insights.

OPAL-SD

An entry-level, semi-automated probe station for single-die testing. It offers flexible, cost-effective, and upgradeable performance, with automated optical alignment and traceable test results. Manual positioning of the die and electrical probes makes it a practical solution for precision testing.

OPAL-MD

A high-performance multi-die test station, delivering fast, accurate, and repeatable results. It’s designed for advanced integrated photonics characterization and allows for flexible testing setups. Open to EXFO and third-party instruments, the OPAL-MD supports comprehensive, data-driven PIC testing.

OPAL-EC

A leading-edge wafer-level test station optimized for edgecoupling. It provides industry-leading accuracy, speed, and flexibility for integrated photonics characterization. The OPAL-EC is ideal for precise wafer-level PIC testing, combining EXFO's optical measurement capabilities with compatibility for third-party instruments.

Designed for scalable, automated PIC testing

A complete ecosystem (automated stations, optical testers and automation software) engineered to deliver flexible, repeatable and high-precision characterization from single die and multiple dies to wafer level.

Complete ecosystem: automated stations, optical testers and automation software in a single solution.

Scalable architecture supporting single‑die, multi‑die and wafer‑level edge‑coupling testing.

Open integration with EXFO and third‑party instruments for flexible lab and manufacturing environments.

High‑precision, repeatable optical alignment enabling reliable photonic device characterization.

Comprehensive testing for integrated photonics development and production.

Photonic integrated circuit testing requires precise measurements and repeatable workflows across research and manufacturing environments. EXFO’s solution addresses key photonics testing challenges by automating measurement processes and enabling consistent characterization at scale.

Active and passive component testing

Mach‑Zehnder modulator characterization

Arrayed waveguide grating (AWG) testing

Ring resonator spectral measurements

Transmission laser testing for transceivers

Functional transceiver testing such as BER and high‑speed eye diagrams