PIC automated probe stations
Our test stations incorporate top-of-the-line equipment to ensure that requirements are met, whatever the situation. Build the best suited station for you, whether you're testing individual chips for R&D or even full production wafers. EXFO’s adaptative test stations can handle any scenario, from individual chips to full production wafers when it comes to photonic integrated circuits (PIC). Equip your station with RF probes, optical heads or any other equipment, as needed.
3 products
New
OPAL-EC - Advanced wafer-level edge-coupling testing station
Accurate, flexible, fast testing of photonic integrated circuits (PIC) with traceable results.
OPAL-MD - Multi-die automated test station
Accurate, automated, fast testing of photonic integrated circuits (PIC) with traceable results.
OPAL-SD - Single-die automated probe station
Entry-level, flexible, cost-effective and upgradeable. Automated optical alignment and test of photonic integrated circuits (PIC) with traceable results that can be queried. Manual positioning of die and electrical probes.