OPAL-EC - Advanced wafer-level edge-coupling testing station

Accurate, flexible, fast testing of photonic integrated circuits (PIC) with traceable results.

OPAL-EC platform

The station’s hardware consists of an ultra-repeatable 4-axis motion system wafer positioning stage, allowing 105° rotation with a chuck to hold up to 12-in (300-mm) wafers with thermal control as an option.

Adapter plates enable tests for single dies, bars and multiple dies enabling one station to fit all form factors. The station can accommodate up to four probing heads with a choice of optical or electrical probes.

It also includes high-resolution, in-line brightfield top vision system and telecentric side vision systems.

Pilot automation software

EXFO Pilot is a software platform that orchestrates the complete flow of PIC test and measurement: (i) test preparation, (ii) execution of fully automated navigation, alignment and measurements at a high throughput and (iii) analysis and data management of the results.

It transforms the OPAL-EC station into an automated testing station and a source of quality measurements that can be processed into actionable data. The complete suite of applications supports the full test-and-measurements flow and helps users to become more data-driven.

Complete PIC testing

Combined with EXFO’s advanced optical measurements capabilities and open to third-party instruments, this complete platform is the ideal PIC testing solution.

Combined with EXFO’s advanced optical measurements capabilities, tunable laser sources (T200S/T500S), passive component testing platforms (CTP10) and open to third-party instruments, this complete platform is the ideal PIC testing solution.

Características principales

Complete PIC testing platform for precise and repeatable optical alignment and electrical probing.

Preparation, automated execution (navigation, alignment, instrument control) and data management (repository, analysis) with the included EXFO Pilot software suite.

Different probe head options, as needed: Optical head models with up to 6 motorized axes for surface- and edge-coupling with single fibers or fiber arrays; Electrical heads with manual or motorized axes.

Best-in-class repeatability of optical probe heads and base motion systems.

Industry first multiport edge-coupling testing at wafer level.

Wafer, stretch-tape, multiple dies or bar testing with the same station.

Flexible design with repositionable optical and RF/DC probes.

Compatible with wafers of up to 12 inches (300 mm).

Aplicaciones

From R&D, design verification and process development to early production and manufacturing.

Opto-electronic testing on integrated photonics platforms: silicon photonics, indium phosphide, III-V, polymer, heterogeneous.

In-depth analysis of statistical circuit performance and yield.

DUT-agnostic: can test singulated dies (single to tens), reticles, custom cuts, bars, 12-inch wafers.

Application-agnostic: telecom and datacom transceivers, quantum, LIDAR, sensors, AI for surface- and edge-coupling with single fiber or fiber-array to prototyping and PILOT production.