Vollständige Spezifikationen

OSICS DFB LANWDM - DFB lasers

Übersicht
The OSICS DFB LANWDM modules are high-performance distributed feedback laser diodes perfect for testing silicon photonics chips.
OSICS DFB LANWDM - DFB lasers

Leistungsmerkmale

  • External and internal LF modulation
  • 10 dBm output power from a single mode fiber with a stability of ±0.01 dB over 1 hour
  • ±30 pm wavelength accuracy and stability of ±5 pm over one hour
  • Wavelength grid matched to LANWDM channels with typical tuning range of 1.8 nm

Spezifikationen

Technical specifications
ModelsaChannel 1: 1309.14 nm / 229.0 THz; Channel 2: 1304.58 nm / 229.8 THz; Channel 3: 1300.05 nm / 230.6 THz; Channel 4: 1295.56 nm / 231.4 THz
Channel centeraGrid matched
Tuning range (nm)a1.6 (1.8 typical)
Wavelength accuracy (nm)b±0.03
Wavelength stability over 1 hour (nm)b, c, d±0.005
Wavelength stability over 24 hours (nm)b, c, d±0.005 typical
Maximum output power (mW)10
Power stability over 1 hour (dB)b, c, d±0.01
Power stability over 24 hours (dB)b, c, d±0.01 typical
Optical isolation (dB)> 30
Relative intensity noise (RIN) (dB/Hz)e< –130
Laser line width (MHz)< 10
SMSR (dB)b> 30 (40 typical)
TTL modulation (internal)1 Hz to 890 kHz
TTL modulation (external)16 Hz to 890 kHz
Analog modulation (external/front panel)150 Hz to 150 MHz
SBS suppression (internal) – waveformSine
SBS suppression (internal) – frequency range (kHz)10 to 100
SBS suppression (internal) – modulation depth (%)0 to 15
Optical fiberSMF; PM13
Fiber alignment to connector keySMF: n/a; PM13: Slow axis
Polarization extinction ratio (PER) (dB)SMF: n/a; PM13: > 17
Optical connectorFC/APC narrow key
Electrical connectorCoaxial SMB – 50 Ω
a. Location of channel center: lower boundary of the range + 0.4 nm < channel center < upper boundary of the range –0.4 nm.
b. After warm-up and at maximum power.
c. At a constant temperature.
d. Measured with an APC terminated jumper on a powermeter.
e. RIN within the range 100 MHz–20 GHz measured at 10 dBm output power with RBW = 30 kHz.
f. See OSICS mainframe specifications sheet for details on OSICS common specifications and interfaces on the rear panel.
General specifications
Laser safetyClass 1M
Dimensions (W × H × D)35 mm × 128 mm × 230 mm (1 3/8 in × 5 in × 9 in)
Weight1.1 kg (2.43 lb)