OPAL-EC -

Accurate, flexible, fast testing of photonic integrated circuits (PIC) with traceable results.

Características principales

Complete PIC testing platform for precise and repeatable optical alignment and electrical probing.

Preparation, automated execution (navigation, alignment, instrument control) and data management (repository, analysis) with the included EXFO Pilot software suite.

Different probe head options, as needed: Optical head models with up to 6 motorized axes for surface- and edge-coupling with single fibers or fiber arrays; Electrical heads with manual or motorized axes.

Best-in-class repeatability of optical probe heads and base motion systems.

Industry first multiport edge-coupling testing at wafer level.

Wafer, stretch-tape, multiple dies or bar testing with the same station.

Flexible design with repositionable optical and RF/DC probes.

Compatible with wafers of up to 12 inches (300 mm).

Aplicaciones

From R&D, design verification and process development to early production and manufacturing.

Opto-electronic testing on integrated photonics platforms: silicon photonics, indium phosphide, III-V, polymer, heterogeneous.

In-depth analysis of statistical circuit performance and yield.

DUT-agnostic: can test singulated dies (single to tens), reticles, custom cuts, bars, 12-inch wafers.

Application-agnostic: telecom and datacom transceivers, quantum, LIDAR, sensors, AI for surface- and edge-coupling with single fiber or fiber-array to prototyping and PILOT production.