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The rules are changing: How can we stay in the game?
EXFO’S first TEST Talk features Lightwave Editorial Director Stephen Hardy holding forth on key trends and challenges in labs and manufacturing, plus in-depth sessions and demos where we address the telecom industry’s changing rules and how researchers and manufacturers now have to play the game.
Disruption is about to hit the telecom industry full force. Content service providers must launch complex high-speed broadband and 5G infrastructure buildouts/upgrades while facing skyrocketing bandwidth demand and adopting new technologies. Network equipment manufacturers and component vendors must embrace this new era of digital transformation while maintaining flexibility and reducing cost pressures. Are they up to the challenge? Not if they hold on to models that won’t scale. They must adapt. They must rethink their design, test and manufacturing strategies from the ground up.
Manufacturers want to speed up fabrication, improve yield and unleash the full potential of analytics. To do so, they must implement lean, efficient automation at all levels of operation.
It’s time for manufacturers to prepare for and make the best use of existing automation technologies using test and measurement industry best practices.
This talk will explain what you need to meet manufacturing automation challenges using real-life use cases.
The telecom industry is moving aggressively toward more interoperability and adopting open environments in 5G, DCI/transport and PON.
This session will provide an overview of the upcoming transceiver MSA (multi source agreement) and cover the latest developments in the Open RAN ecosystem.
The last 50 years of software development have taught us many lessons and techniques that we can apply when designing next-generation transceivers for testability.
Learn and share new ideas and approaches to optimize the entire development-to-deployment cycle of silicon photonics-based transceivers.
Scaling up a data center has traditionally included adding transceivers. But their physical size and power consumption threaten to stretch data centers to the breaking point.
For the telecom market to grow and meet ever-burgeoning demand, radical new technical solutions must be found. Using photonic integrated circuits (PICs) is one of the most promising of these solutions.
Join us to learn more about these tiny but mighty photonic components and how to test them.
How to future-proof PIC testing
Next-generation photonic technology calls for next-generation testing capabilities. Find out more on April 22 when we discuss these capabilities with industry experts Ana González (EPIC), François Menard (AEPONYX), Shon Schmidt (Maple Leaf Photonics) and François Couny (EXFO). After the panel discussion, join in-depth technical sessions with subject matter experts.
New era of transceivers: 400G and beyond
Transceiver testing challenges loom large as the telecom industry defines 800G while also deploying 400G widely. Industry experts David J. Rodgers (Ethernet Alliance-Teledyne), Faisal Dada (Xilinx), Leo Lin (EXFO) and Jean-Marie Vilain (EXFO) share insights during a live panel discussion about the new wave of transceivers. After the panel discussion, join in-depth technical sessions with subject matter experts.
5G challenges from R&D to field deployment
Questions about 5G testing abound in contexts including R&D, fiber deployment in the field, xHaul transport, transceiver testing and open RAN evolution. Want answers? Our panelists have them. Join us on May 6 when industry experts Antonio Tartaglia (Ericsson), Luis Miguel Contreras Murillo (Telefónica), Harpinder Matharu (Xilinx) and Sophie Legault (EXFO) will share the lessons they’ve learned. After the panel discussion, join in-depth technical sessions with subject matter experts.