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  • EN

Meeting the challenges in testing spectral photonic integrated circuits (PIC)

Hosted by

Lawrence van der Vegt

Senior Product Line Manager, EXFO

Lawrence is an optics veteran; he earned his Bachelor’s degree in Electrical and Computer Engineering in the Netherlands and has held various key Directorial positions at optical T&M companies in the Netherlands and the U.S.A. He is currently active as a Subject Matter Expert on behalf of EXFO, involved in passive and active component testing driven by PIC technologies.

Hosted by OSA

Photonic integrated circuits (PICs) are a well-known technology in the communications world, driving the efforts for high-speed networks and 5G developments through the rapid development of transceivers and components that are much smaller, faster, cheaper and energy-efficient than their bulk-optics predecessors.

With a view to best address spectral test challenges of these up-and-coming components, EXFO has been working closely with the PIC front-end drivers. This webinar, sponsored by OIDA Technology Showcase, delves into the solutions and best practices in overcoming these challenges. We’ll be available to reach out to you as needed during the Q&A session at the end.

Key takeaways:

  • Identifying the challenges in testing PIC technology
  • Future-proofing PIC spectral characterization
  • Testing throughout the PIC ecosystem; from design to mass production of optical components

EXFO’s presentation is part of the OIDA Technology Showcase, a 3-day virtual event consisting of unique product presentations, discussion, and networking. To view the full schedule and more about the participating companies, please visit our website. Each day will consist of two parts – the showcase presentation where each company will have 15 minutes to present with an additional 5 minutes for Q&A, followed by networking where attendees can join each company in separate breakout room to meet face to face, ask any follow up questions and make new connections.

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