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Kevin Peres

April 13, 2021

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Kevin Peres

April 20, 2021

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Fiber testing: the right thresholds and why they matter

Christian Till

February, 2021

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Best practices for activating high-speed networks—transport layer

High speed networks (100G+) NEMs and lab
  • June 28, 2015

Diong Ming Cheng

Application Engineer, EXFO

Diong Ming Cheng is Application Engineer for EXFO APAC Singapore Ltd, a Leading Test & Measurement provider headquarter in Canada, Quebec.In this role, Diong is responsible to present EXFO solution of Transport & Datacom range of products in the T&M Pre-Sales activities particularly in the ANZ and SEA.Over the past 5 years, Diong has been actively engaging and educating service providers in the field to adopt best practice and solutions in the Optical transport, Ethernet transport, MPLS/IP Networks and also next generation transport network.

Exclusive webinar series on high speed networks/DWDM

EXFO is proud to present its webinar series on high speed networks, 40G/100G, and dense wavelength-division multiplexing (DWDM) technology. This webinar series will discuss the best practices for deploying 100G/DWDM networks, as well as ensuring the success of the activation and maintenance phases, for optics and transport. It will also discuss the recommended tests in each stage of the network's life cycle.

Part 4: Best Practices for the Activation of High Speed Networks ­– Transport Layer

  • General description of the OTN and high-speed Ethernet
    • A primer on high-speed parallel interfaces: PCS tracks and logics, distortion, markets, etc.
    • EoOTN: Localization of 40GE and 100GE client signals within an OTN network
  • Issues: Dispelling the myths associated with different types of high-speed optical interfaces, such as CFP, CFP2 and CF4
  • How to successfully install and activate 100G networks

More webinars

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400G and beyond: Driving next generation data centers

December, 2020

High speed networks (100G+)

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Next-gen, PIC-based transceivers : design, test and validation

Aldo Gutiérrez

November, 2020

NEMs and lab

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Meeting the challenges in testing spectral photonic integrated circuits (PIC)

Lawrence van der Vegt

August, 2020

NEMs and lab

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